M378B1G73QH0-CK0 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
Surface Mount NO
Number of Terminals 240Terminals
EU RoHS Compliant
ECCN (US) 4A994.a
Automotive No
PPAP No
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.225
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 1040
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Mounting Socket
Package Height 30
Package Width 4(Max)
Package Length 133.35
PCB changed 240
Supplier Package UDIMM
Lead Shape No Lead
Package Description DIMM,
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 1000000000Words Codes
Package Body Material UNSPECIFIED
Operating Temperature-Max 85 °C
Manufacturer Part Number M378B1G73QH0-CK0
Number of Words 1073741824 wordsWord
Supply Voltage-Nom (Vsup) 1.5 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Samsung Semiconductor
Part Life Cycle Code Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Risk Rank 5.67
Part Status Obsolete
Additional Feature AUTO/SELF REFRESH; WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 240
JESD-30 Code R-XDMA-N240
Supply Voltage-Max (Vsup) 1.575 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.425 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 1Gx64
Seated Height-Max 30.15 mm
Memory Width 64
Memory Density 68719476736 bit
PLL No
Memory IC Type DDR DRAM MODULE
Access Mode DUAL BANK PAGE BURST
Self Refresh Yes
Module Type 240UDIMM
Width 4 mm
Length 133.35 mm
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