Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

M378B5773CH0-CH900 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) 4A994.a
Automotive No
PPAP No
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.255
Maximum Clock Rate (MHz) 1333
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 1120
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Single
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support Yes
Mounting Socket
Package Height 30
Package Width 4(Max)
Package Length 133.35
PCB changed 240
Supplier Package UDIMM
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 256Mx64
PLL No
Self Refresh Yes
Module Type 240UDIMM
Select at least one checkbox above to show similar products in this category.
View Similar
M378B5773CH0-CH900 brand manufacturers: Samsung Semiconductor, Elecinsight stock, M378B5773CH0-CH900 reference price.Samsung Semiconductor. M378B5773CH0-CH900 parameters, M378B5773CH0-CH900 Datasheet PDF and pin diagram description download.You can use the M378B5773CH0-CH900 Memory - Modules, DSP Datesheet PDF, find M378B5773CH0-CH900 pin diagram and circuit diagram and usage method of function,M378B5773CH0-CH900 electronics tutorials.You can download from the Elecinsight.