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M386A8K40BM2-CTD6Y Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant with Exemption
HTS 8473.30.11.40
SVHC Yes
SVHC Exceeds Threshold Yes
Automotive No
PPAP No
Module DRAM Module
Module Density 64Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 16G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.17
Maximum Clock Rate (MHz) 2666
Chip Configuration 4Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 5147
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks QuadRank
Number of Chip Banks 16Chip Banks
CAS Latency 19
SPD EEPROM Support No
Mounting Socket
Package Height 31.25
Package Width 4.3(Max)
Package Length 133.35
PCB changed 288
Supplier Package LRDIMM
Part Status LTB
Pin Count 288
Organization 8Gx72
PLL No
Self Refresh Yes
Module Type 288LRDIMM
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