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M386ABG40M50-CYF Tech Specifications

Category Memory - Modules
Manufacturer Samsung
HTS 8473.30.11.40
Automotive No
PPAP No
Module DRAM Module
Module Density 256Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 64G
Maximum Clock Rate (MHz) 2933
Chip Configuration 16Gx4
Typical Operating Supply Voltage (V) 1.2
Number of Ranks OctalRank
Part Status Preliminary
Module Type 288LRDIMM
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