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M391B1G73QH0-YK0 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
HTS 8542.32.00.71
Automotive No
PPAP No
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.225
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.283
Typical Operating Supply Voltage (V) 1.35
Maximum Operating Supply Voltage (V) 1.45
Operating Current (mA) 1125
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Mounting Socket
Package Height 30
Package Width 4(Max)
Package Length 133.35
PCB changed 240
Supplier Package UDIMM
Part Status Obsolete
Pin Count 240
Organization 1Gx72
PLL No
Self Refresh Yes
Module Type 240UDIMM
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