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M393A1G40EB1-CPB Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) 4A994.a
HTS 8542.32.00.36
Automotive No
PPAP No
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.18
Maximum Clock Rate (MHz) 2133
Chip Configuration 1Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 1673
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
Number of Chip Banks 16Chip Banks
CAS Latency 15
SPD EEPROM Support No
Mounting Socket
PCB changed 288
Supplier Package RDIMM
Part Status Active
Pin Count 288
Organization 1Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
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