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M393A2K43CB1-CRC Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) 4A994.a
Automotive No
PPAP No
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.175
Maximum Clock Rate (MHz) 2400
Chip Configuration 1Gx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 1202
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 16Chip Banks
CAS Latency 17
SPD EEPROM Support No
Mounting Socket
Package Height 31.25
Package Width 1.4 + 2.8(Max)
Package Length 133.35
PCB changed 288
Supplier Package RDIMM
Part Status Obsolete
Pin Count 288
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
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