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M393B2G70DB0-YK0 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) 4A994.a
HTS 8473.30.11.40
Automotive No
PPAP No
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.225
Maximum Clock Rate (MHz) 1600
Chip Configuration 1Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.283
Typical Operating Supply Voltage (V) 1.35
Maximum Operating Supply Voltage (V) 1.45
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
SPD EEPROM Support Yes
Part Status Obsolete
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
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