Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

M395T2863QZ4-CE66 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
Automotive No
PPAP No
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Mounting Socket
Package Height 30.35
Package Width 8.2(Max)
Package Length 133.35
PCB changed 240
Supplier Package FBDIMM
ECCN (US) EAR99
EU RoHS Compliant
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 128Mx72
PLL Yes
Self Refresh Yes
Module Type 240FBDIMM
Select at least one checkbox above to show similar products in this category.
View Similar
M395T2863QZ4-CE66 brand manufacturers: Samsung Semiconductor, Elecinsight stock, M395T2863QZ4-CE66 reference price.Samsung Semiconductor. M395T2863QZ4-CE66 parameters, M395T2863QZ4-CE66 Datasheet PDF and pin diagram description download.You can use the M395T2863QZ4-CE66 Memory - Modules, DSP Datesheet PDF, find M395T2863QZ4-CE66 pin diagram and circuit diagram and usage method of function,M395T2863QZ4-CE66 electronics tutorials.You can download from the Elecinsight.