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M395T2863QZ4-CE66 Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 1G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 667
Chip Configuration 128Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 5
PC Type PC2-5300
SPD EEPROM Support Yes
Mounting Socket
Package Height 30.35
Package Width 8.2(Max)
Package Length 133.35
PCB changed 240
Supplier Package FBDIMM
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 128Mx72
PLL Yes
Self Refresh Yes
Module Type 240FBDIMM
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