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M471A1K43DB1-CTD Tech Specifications

Category Memory - Modules
Manufacturer Samsung
EU RoHS Compliant
HTS 8473.30.11.40
Automotive No
PPAP No
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Max. Access Time (ns) 0.17
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 16Chip Banks
CAS Latency 19
SPD EEPROM Support No
Mounting Surface Mount
Package Height 0.73
Package Width 10.3
Package Length 11
PCB changed 78
Supplier Package FBGA
Part Status Active
Pin Count 78
Organization 1Gx64
PLL No
Self Refresh Yes
Module Type 260SODIMM
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