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HSEC8-130-01-S-D-EM2 Tech Specifications

Category Card Edge Connectors - Edgeboard Connectors
Manufacturer Samtec
Factory Lead Time 3 Weeks
Mount Edge
Mounting Type Board Edge, Straddle Mount
Housing Material Polymer
Material - Insulation Liquid Crystal Polymer (LCP)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Tube
Series Edge Rate™ HSEC8
Published 2013
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 60Positions
Color Black
Number of Rows 2Rows
Gender Female
Additional Feature POLARIZED, MICRO CARD
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Cantilever
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.031 0.80mm
Total Number of Contacts 60Contacts
Orientation Straight
Number of Conductors ONEConductor
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 1.669 inch
UL Flammability Code 94V-0
Body Depth 0.504 inch
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 30Positions/Bay/Rows
Body/Shell Style SOCKET
Max Current Rating 3.1A
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.062 1.57mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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HSEC8-130-01-S-D-EM2 Documents

Download datasheets and manufacturer documentation for   HSEC8-130-01-S-D-EM2

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