SED1330FBB Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer SEIKO
Surface Mount YES
Number of Terminals 60Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SEIKO EPSON CORP
Package Description QFP,
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Type of integrated circuit driver
Kind of integrated circuit gate driver
Case SOP16
Integrated circuit features galvanically isolated
Mounting SMD
Kind of package reel,
Insulation voltage 5kV
Gross weight 1 g
Operating temperature -40...125°C
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature ALSO SUPPORTS GRAPHICS MODE
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code S-PQFP-G60
Qualification Status Not Qualified
Number of channels 2channels
Output current -6...4A
uPs/uCs/Peripheral ICs Type DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY
Seated Height-Max 3.1 mm
External Data Bus Width 8
Bus Compatibility 8088; 6800; 8085
Display Configuration 640 X 256 DOTS
Length 14 mm
Width 14 mm
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