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60011-055 Tech Specifications
Category | Interface - Modules | |
Manufacturer | Sensata Technologies | |
Material | Aluminum | |
Shape | Square, Fins | |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
Material Finish | Blue Anodized | |
RoHS | Non-Compliant | |
Series | pushPIN™ | |
Part Status | Active | |
Type | Top Mount |
Subcategory | Embedded Solutions | |
Attachment Method | Push Pin | |
Height Off Base (Height of Fin) | 0.394 (10.00mm) | |
Thermal Resistance @ Forced Air Flow | 15.71°C/W @ 100 LFM | |
Product Type | Interface Modules | |
Thermal Resistance @ Natural | -- | |
Power Dissipation @ Temperature Rise | -- | |
Width | 1.181 (30.00mm) | |
Length | 1.181 (30.00mm) | |
Diameter | -- |
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