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- SI32172-C-GM1
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SI32172-C-GM1 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Silicon Labs | |
Factory Lead Time | 8 Weeks | |
Mounting Type | Surface Mount | |
Package / Case | 42-VFQFN Exposed Pad | |
Surface Mount | YES | |
Operating Temperature | -40°C~85°C | |
Packaging | Tray | |
Series | ProSLIC® | |
Published | 2014 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Number of Terminations | 42Terminations | |
Power (Watts) | 750mW | |
Voltage - Supply | 3.13V~3.47V | |
Terminal Position | BOTTOM |
Terminal Form | BUTT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Supply Voltage | 3.3V | |
Terminal Pitch | 0.5mm | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | R-XBCC-B42 | |
Function | Subscriber Line Interface Concept (SLIC), CODEC | |
Operating Supply Voltage | 3.3V | |
Interface | ISI | |
Number of Circuits | 1Circuit | |
Telecom IC Type | TELECOM CIRCUIT | |
Length | 7mm | |
Height Seated (Max) | 0.9mm | |
Width | 5mm | |
RoHS Status | RoHS Compliant |
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SI32172-C-GM1 Documents
Download datasheets and manufacturer documentation for SI32172-C-GM1
- DatasheetsSI327x-C Data Short
- PCN PackagingPB-1410293 29/Oct/2014
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