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HY64UD16322A-DF70E Tech Specifications

Category Specialized
Manufacturer SK HYNIX INC
Surface Mount YES
Number of Terminals 48Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Package Description FBGA, BGA48,6X8,30
Access Time-Max 70 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.025 mA
Organization 2MX16
Output Characteristics 3-STATE
Memory Width 16
Standby Current-Max 0.000002 A
Memory Density 33554432 bit
I/O Type COMMON
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HY64UD16322A-DF70E Documents

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