SMSC COM20020P Application Specific MCUs
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COM20020P Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | ||
| Surface Mount | NO | |
| Number of Terminals | 24Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | STANDARD MICROSYSTEMS CORP | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-24 | |
| Clock Frequency-Max | 40 MHz | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | DUAL |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | 235 | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 24 | |
| JESD-30 Code | R-PDIP-T24 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN | |
| Supply Current-Max | 50 mA | |
| Seated Height-Max | 3.81 mm | |
| Address Bus Width | 3 | |
| Boundary Scan | NO | |
| Low Power Mode | NO | |
| External Data Bus Width | 8 | |
| RAM (words) | 1024 | |
| Number of Serial I/Os | 1Serial I/O | |
| Bus Compatibility | 8051; 6801 | |
| On Chip Data RAM Width | 8 | |
| Data Transfer Rate-Max | 0.625 MBps | |
| Data Encoding/Decoding Method | NRZ | |
| Length | 31.877 mm | |
| Width | 15.24 mm |
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COM20020P Documents
Download datasheets and manufacturer documentation for COM20020P
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