CXK5864BSP-70LL Tech Specifications

Category Memory
Manufacturer Taiwan Semiconductor
Surface Mount NO
Number of Terminals 28Terminals
Number of Words 8192 wordsWord
Number of Words Code 8000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
Access Time-Max 70 ns
Package Description DIP, DIP28,.3
Part Package Code DIP
Ihs Manufacturer SONY CORP
Part Life Cycle Code Obsolete
Rohs Code No
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Terminal Finish TIN LEAD
HTS Code 8542.32.00.41
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 28
JESD-30 Code R-PDIP-T28
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.5 V
Number of Ports 1Port
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.05 mA
Organization 8KX8
Output Characteristics 3-STATE
Seated Height-Max 4.4 mm
Memory Width 8
Standby Current-Max 0.000015 A
Memory Density 65536 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 2 V
Output Enable YES
Length 35.1 mm
Width 7.62 mm
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