S71GL128NB0BFW9Z0 Tech Specifications

Category Specialized
Manufacturer
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SPANSION INC
Part Package Code BGA
Package Description 8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64
Moisture Sensitivity Levels 3
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e1
ECCN Code 3A991.B.1.A
Terminal Finish TIN SILVER COPPER
Additional Feature PSRAM IS ORGANIZED AS 2M X 16
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.1 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 8MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 134217728 bit
Memory IC Type MEMORY CIRCUIT
Length 11.6 mm
Width 8 mm
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