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STMicroelectronics M27C1001-25F1 Memory ICs
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M27C1001-25F1 Tech Specifications
| Category | Memory | |
| Manufacturer | STMicroelectronics | |
| Surface Mount | NO | |
| Material | Aluminum | |
| Shape | Square, Fins | |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
| Material Finish | Blue Anodized | |
| Number of Terminals | 32Terminals | |
| Package Description | LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | |
| Package Style | IN-LINE, WINDOW | |
| Number of Words Code | 128000Words Codes | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Equivalence Code | DIP32,.6 | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 250 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | M27C1001-25F1 | |
| Number of Words | 131072 wordsWord | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | STMicroelectronics | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Risk Rank | 5.32 | |
| Part Package Code | DIP | |
| Series | pushPIN™ | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes | |
| Part Status | Active | |
| ECCN Code | EAR99 | |
| Type | Top Mount | |
| Terminal Finish | Matte Tin (Sn) | |
| Additional Feature | 00.1.142 |
| HTS Code | 8542.32.00.61 | |
| Subcategory | EPROMs | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 32 | |
| JESD-30 Code | R-CDIP-T32 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Power Supplies | 5 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Attachment Method | Push Pin | |
| Height Off Base (Height of Fin) | 0.590 (15.00mm) | |
| Thermal Resistance @ Forced Air Flow | 13.38°C/W @ 100 LFM | |
| Operating Mode | ASYNCHRONOUS | |
| Supply Current-Max | 0.03 mA | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 5.72 mm | |
| Memory Width | 8 | |
| Standby Current-Max | 0.0001 A | |
| Memory Density | 1048576 bit | |
| Parallel/Serial | PARALLEL | |
| I/O Type | COMMON | |
| Memory IC Type | UVPROM | |
| Thermal Resistance @ Natural | -- | |
| Power Dissipation @ Temperature Rise | -- | |
| Width | 2.126 (54.00mm) | |
| Length | 2.126 (54.01mm) | |
| Diameter | -- |
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M27C1001-25F1 Documents
Download datasheets and manufacturer documentation for M27C1001-25F1
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