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M29W128GL70ZA6E Tech Specifications

Category Memory - Modules
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64
Access Time-Max 70 ns
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.02 mA
Organization 8MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.0001 A
Memory Density 134217728 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128Sectors/Sizes
Sector Size 128K
Page Size 8/16 words
Ready/Busy YES
Common Flash Interface YES
Length 13 mm
Width 10 mm
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