M36DR232A120ZA6C Tech Specifications

Category Specialized
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 66Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 0.80 MM PITCH, STACK, LFBGA-66
Access Time-Max 120 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA66,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code not_compliant
Pin Count 66
JESD-30 Code R-PBGA-B66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.2 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.65 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.04 mA
Organization 2MX16
Seated Height-Max 1.4 mm
Memory Width 16
Standby Current-Max 0.000025 A
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
Length 12 mm
Width 8 mm
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M36DR232A120ZA6C Documents

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