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M58LW032D90ZA1Q Tech Specifications

Category Memory - Modules
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 64Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 10 X 13 MM, 1 MM PITCH, TBGA-64
Access Time-Max 90 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code unknown
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 2MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 33554432 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Length 13 mm
Width 10 mm
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