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NAND01GW3B2CZA6 Tech Specifications

Category Memory - Modules
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 63Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description TFBGA,
Access Time-Max 35 ns
Number of Words 134217728 wordsWord
Number of Words Code 128000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish TIN LEAD
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 63
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 128MX8
Seated Height-Max 1.05 mm
Memory Width 8
Memory Density 1073741824 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Length 12 mm
Width 9.5 mm
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NAND01GW3B2CZA6 Documents

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