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NAND02GW3B2DZA6F Tech Specifications

Category Memory - Modules
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 63Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Package Description FBGA, BGA63,10X12,32
Access Time-Max 20 ns
Number of Words 268435456 wordsWord
Number of Words Code 256000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 0.03 mA
Organization 256MX8
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 2147483648 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 128K
Page Size 2K words
Ready/Busy YES
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NAND02GW3B2DZA6F Documents

Download datasheets and manufacturer documentation for   NAND02GW3B2DZA6F

  • Datasheets
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