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NAND512R3A2CZA6E Tech Specifications

Category Memory
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 64Terminals
Access Time-Max 45 ns
Ihs Manufacturer MICRON TECHNOLOGY INC
Manufacturer Micron Technology Inc
Manufacturer Part Number NAND512R3A2CZA6E
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA64,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Part Life Cycle Code Obsolete
Risk Rank 5.81
Rohs Code Yes
Supply Voltage-Nom (Vsup) 1.8 V
Type SLC NAND TYPE
Subcategory Flash Memories
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Power Supplies 1.8 V
Temperature Grade INDUSTRIAL
Supply Current-Max 0.015 mA
Organization 64MX8
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 536870912 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4K
Sector Size 16K
Page Size 512 words
Ready/Busy YES
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NAND512R3A2CZA6E Documents

Download datasheets and manufacturer documentation for   NAND512R3A2CZA6E

  • Datasheets
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