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NAND512W3A2DZA6E Tech Specifications

Category Memory - Modules
Manufacturer STMicroelectronics
Surface Mount YES
Number of Terminals 63Terminals
Type of enclosure multipurpose
Dimension X 122mm
Dimension Y 2220mm
Dimension Z 91mm
Enclosure material polyester
Body colour black
Enclosure description glass fiber reinforced
Conform to the norm ATEX Ex
Dimensions See
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer STMICROELECTRONICS
Part Package Code BGA
Package Description 8.50 X 15 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63
Access Time-Max 12000 ns
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Nom (Vsup) 3 V
Operating temperature -40...100°C
ECCN Code EAR99
Type SLC NAND TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 63
JESD-30 Code R-PBGA-B63
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 64MX8
Memory Width 8
Memory Density 536870912 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
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NAND512W3A2DZA6E Documents

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