Symbios Semiconductors SYM53C895 Application Specific MCUs
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SYM53C895 Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | Taiwan Semiconductor | |
| Surface Mount | YES | |
| Number of Terminals | 208Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SYMBIOS SEMICONDUCTORS | |
| Package Description | QFP, QFP208,1.2SQ,20 | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE |
| Package Style | FLATPACK | |
| Supply Voltage-Nom | 3.3 V | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Supply Current-Max | 130 mA |
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SYM53C895 Documents
Download datasheets and manufacturer documentation for SYM53C895
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