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2013310-3 Tech Specifications
| Category | Memory Connectors - Inline Module Sockets | |
| Manufacturer | TE Connectivity | |
| Contact Plating | Gold | |
| Housing Material | Thermoplastic | |
| Voltage, Rating | 1.5 V | |
| Factory Pack QuantityFactory Pack Quantity | 20 | |
| Mounting Styles | PCB Mount | |
| Contact Materials | Copper Alloy | |
| Manufacturer | TE Connectivity | |
| Brand | TE Connectivity | |
| RoHS | Details |
| Packaging | Tray | |
| Type | DDR3 | |
| Number of Positions | 204 PositionPosition | |
| Subcategory | Memory Connectors & Sockets | |
| Pitch | 0.6 mm | |
| Termination Style | SMD/SMT | |
| Product Type | DIMM Connectors | |
| Product | SODIMM | |
| Mounting Angle | Right | |
| Product Category | DIMM Connectors | |
| Height | 9.2 mm |
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