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EVS32M16T-5 BI Tech Specifications

Category Memory Cards
Manufacturer E2V
HTS 8542.32.00.41
Module DRAM Module
Module Density 1Gbit
Number of Chip per Module 2Chip per Modules
Chip Density (bit) 512M
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 167
Chip Configuration 32Mx16
Chip Package Type 66TSOP-II
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 2.7
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support No
Number of Chip Banks 4Chip Banks
CAS Latency 3
SPD EEPROM Support No
Supplier Package TSOP-II
Mounting Surface Mount
Package Height 1.8(Min)
Package Length 22.62(Max)
PCB changed 66
Pin Count 66
Organization 64Mx16
PLL No
Self Refresh Yes
RoHS Status Supplier Unconfirmed
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EVS32M16T-5 BI Documents

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