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5962-3829411MZA Tech Specifications

Category Memory
Manufacturer TEMIC
Surface Mount NO
Number of Terminals 28Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer TEMIC SEMICONDUCTORS
Package Description DIP-28
Access Time-Max 45 ns
Number of Words 8192 wordsWord
Number of Words Code 8000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-GDIP-T28
Qualification Status Not Qualified
Temperature Grade MILITARY
Number of Ports 1Port
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.125 mA
Organization 8KX8
Output Characteristics 3-STATE
Memory Width 8
Standby Current-Max 0.02 A
Memory Density 65536 bit
Screening Level MIL-STD-883
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 4.5 V
Output Enable YES
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