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HM3-65767N-5 Tech Specifications

Category Memory
Manufacturer TEMIC
Surface Mount NO
Number of Terminals 20Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS
Access Time-Max 40 ns
Number of Words 16384 wordsWord
Number of Words Code 16000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.41
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T20
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.09 mA
Organization 16KX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.03 A
Memory Density 16384 bit
Parallel/Serial PARALLEL
I/O Type SEPARATE
Memory IC Type STANDARD SRAM
Standby Voltage-Min 4.5 V
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HM3-65767N-5 Documents

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