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AM3351BZCE60 Tech Specifications

Category Embedded - Microprocessors
Manufacturer Texas Instruments
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 298-LFBGA
Number of Pins 298Pins
Memory Types FLASH
Operating Temperature 0°C~90°C TJ
Packaging Tray
Series Sitara™
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 298Terminations
ECCN Code 5A992C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Terminal Pitch 0.65mm
Frequency 600MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number AM3351
Interface SPI
Max Supply Voltage 1.144V
Min Supply Voltage 912mV
Memory Size 128kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A8
Bit Size 32
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2, DDR3, DDR3L
USB USB 2.0 + PHY (1)
Additional Interfaces I2C, McASP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Number of Cores 1Core
Security Features Cryptography, Random Number Generator
Display & Interface Controllers LCD, Touchscreen
Number of DMA Channels 64DMA Channels
Height 1.3mm
Length 13mm
Width 13mm
Thickness 890μm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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