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AM3354BZCZD60 Tech Specifications

Category Embedded - Microprocessors
Manufacturer Texas Instruments
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 324-LFBGA
Surface Mount YES
Number of Pins 324Pins
Weight 1.713814g
Memory Types Cache, RAM, ROM
Operating Temperature -40°C~90°C TJ
Packaging Tray
Series Sitara™
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324Terminations
ECCN Code 5A992.C
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Frequency 600MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number AM3354
Qualification Status Not Qualified
Operating Supply Voltage 1.1V
Voltage 1.144V
Interface CAN, Ethernet, I2C, SPI, UART, USB
RAM Size 64kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A8
Bit Size 32
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Number of UART Channels 6UART Channels
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2, DDR3, DDR3L
USB USB 2.0 + PHY (2)
Additional Interfaces CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Number of Cores 1Core
Security Features Cryptography, Random Number Generator
Display & Interface Controllers LCD, Touchscreen
Height 1.4mm
Length 15mm
Width 15mm
Thickness 900μm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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