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DLP650LETFYL Tech Specifications

Category Specialized ICs
Manufacturer Texas Instruments
Mounting Type Through Hole
Package / Case 149-BCPGA
Supplier Device Package 149-CLGA (32.2x22.3)
RoHS Non-Compliant
Package Bulk
Mfr Texas Instruments
Product Status Active
Packaging Bulk
Series -
Tolerance 0.1 %
Number of Terminations 2Terminations
Temperature Coefficient 8 ppm/°C
Type Digital Micromirror Device (DMD)
Resistance 1 kΩ
Max Operating Temperature 150 °C
Min Operating Temperature -55 °C
Composition Metal Foil
Applications -
Max Power Dissipation 150 mW
Length 12.7 mm
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