DM74S570AJ Tech Specifications

Category Memory - Modules
Manufacturer Texas Instruments
Surface Mount NO
Number of Terminals 16Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP16,.3
Access Time-Max 45 ns
Number of Words 512 wordsWord
Number of Words Code 512Words Codes
Operating Temperature-Max 70 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 16
JESD-30 Code R-GDIP-T16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.13 mA
Organization 512X4
Output Characteristics OPEN-COLLECTOR
Seated Height-Max 5.08 mm
Memory Width 4
Memory Density 2048 bit
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Length 19.43 mm
Width 7.62 mm
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DM74S570AJ Documents

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