DM74S573AJ Tech Specifications

Category Memory - Modules
Manufacturer Texas Instruments
Surface Mount NO
Number of Terminals 18Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP18,.3
Access Time-Max 45 ns
Number of Words 1024 wordsWord
Number of Words Code 1000Words Codes
Operating Temperature-Max 70 °C
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 18
JESD-30 Code R-GDIP-T18
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.14 mA
Organization 1KX4
Output Characteristics 3-STATE
Seated Height-Max 5.08 mm
Memory Width 4
Memory Density 4096 bit
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
Width 7.62 mm
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