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OMAPL137DZKBT3 Tech Specifications

Category Embedded - Microprocessors
Manufacturer Texas Instruments
Lifecycle Status ACTIVE (Last Updated: 6 days ago)
Factory Lead Time 6 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 256-BGA
Number of Pins 256Pins
Memory Types Cache, FLASH
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series OMAP-L1x
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Frequency 375MHz
Base Part Number OMAPL137
Interface Ethernet, I2C, SPI, UART, USB
Max Supply Voltage 1.32V
Min Supply Voltage 1.14V
Memory Size 32kB
RAM Size 128kB
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor ARM926EJ-S
Data Bus Width 16b
Core Architecture ARM
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Number of UART Channels 3UART Channels
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
Number of Timers 3Timers
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Number of Cores 1Core
Barrel Shifter NO
Internal Bus Architecture SINGLE
Display & Interface Controllers LCD
Height 2.05mm
Length 17mm
Width 17mm
Thickness 1.36mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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