TBP38S22-25N Tech Specifications

Category Memory - Modules
Manufacturer Texas Instruments
Surface Mount NO
Number of Terminals 20Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description DIP, DIP20,.3
Access Time-Max 55 ns
Number of Words 256 wordsWord
Number of Words Code 1000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Pbfree Code No
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDIP-T20
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.175 mA
Organization 1KX8
Memory Width 8
Memory Density 8192 bit
Parallel/Serial PARALLEL
Memory IC Type OTP ROM
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