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TDA2EGBDQCBDQ1 Tech Specifications

Category Embedded - Microcontroller, Microprocessor, FPGA Modules
Manufacturer Texas Instruments
Surface Mount YES
Number of Terminals 538Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description LFBGA,
Date Of Intro 2018-08-26
Moisture Sensitivity Levels 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Max 1.2 V
Supply Voltage-Min 1.11 V
Supply Voltage-Nom 1.15 V
JESD-609 Code e1
ECCN Code 5A992.C
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B538
Temperature Grade AUTOMOTIVE
uPs/uCs/Peripheral ICs Type SoC
Seated Height-Max 1.298 mm
Screening Level AEC-Q100
Length 17 mm
Width 17 mm
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TDA2EGBDQCBDQ1 Documents

Download datasheets and manufacturer documentation for   TDA2EGBDQCBDQ1

  • Datasheets
TDA2EGBDQCBDQ1 brand manufacturers: Texas Instruments, Elecinsight stock, TDA2EGBDQCBDQ1 reference price.Texas Instruments. TDA2EGBDQCBDQ1 parameters, TDA2EGBDQCBDQ1 Datasheet PDF and pin diagram description download.You can use the TDA2EGBDQCBDQ1 Embedded - Microcontroller, Microprocessor, FPGA Modules, DSP Datesheet PDF, find TDA2EGBDQCBDQ1 pin diagram and circuit diagram and usage method of function,TDA2EGBDQCBDQ1 electronics tutorials.You can download from the Elecinsight.