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- TDA2PHFUQACDQ1
Texas Instruments TDA2PHFUQACDQ1 Microcontroller & FPGA Modules
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TDA2PHFUQACDQ1 Tech Specifications
| Category | Embedded - Microcontroller, Microprocessor, FPGA Modules | |
| Manufacturer | Texas Instruments | |
| Surface Mount | YES | |
| Number of Terminals | 784Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, | |
| Date Of Intro | 2018-12-09 | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Supply Voltage-Max | 1.2 V | |
| Supply Voltage-Min | 1.11 V | |
| Supply Voltage-Nom | 1.15 V |
| JESD-609 Code | e1 | |
| Pbfree Code | Yes | |
| ECCN Code | 5A992.C | |
| Terminal Finish | TIN SILVER COPPER | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | S-PBGA-B784 | |
| Temperature Grade | AUTOMOTIVE | |
| uPs/uCs/Peripheral ICs Type | SoC | |
| Seated Height-Max | 1.63 mm | |
| Screening Level | AEC-Q100 | |
| Length | 23 mm | |
| Width | 23 mm |
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