Thomson Electron Tubes & Devices Corp TS68882MR25 Embedded Microprocessors
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TS68882MR25 Tech Specifications
| Category | Embedded - Microprocessors | |
| Manufacturer | STMicroelectronics | |
| Surface Mount | NO | |
| Number of Terminals | 68Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON ELECTRON TUBES & DEVICES CORP | |
| Package Description | PGA, PGA68,10X10 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | PGA | |
| Package Equivalence Code | PGA68,10X10 | |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| ECCN Code | 3A001.A.2.C | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | PERPENDICULAR | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-XPGA-P68 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY |
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