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- TC74HC564AP(F)
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TC74HC564AP(F) Tech Specifications
| Category | Logic - Flip Flops | |
| Manufacturer | Toshiba | |
| Mount | Through Hole | |
| Number of Pins | 20Pins | |
| ECCN (US) | EAR99 | |
| Logic Family | HC | |
| Number of Channels per Chip | 8Channels per Chips | |
| Number of Elements per Chip | 1 | |
| Number of Element Inputs | 8Element Inputs | |
| Number of Element Outputs | 8Element Outputs | |
| Number of Output Enables per Element | 1 | |
| Bus Hold | No | |
| Triggering Type | Positive-Edge | |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 190@2V|38@4.5V|33@6V | |
| Absolute Propagation Delay Time (ns) | 240 | |
| Process Technology | CMOS | |
| Input Signal Type | Single-Ended | |
| Maximum Low Level Output Current (mA) | 7.8 | |
| Maximum High Level Output Current (mA) | -7.8 | |
| Minimum Operating Supply Voltage (V) | 2 | |
| Typical Operating Supply Voltage (V) | 3.3|5|2.5 | |
| Maximum Operating Supply Voltage (V) | 6 | |
| Maximum Quiescent Current (mA) | 0.004 | |
| Propagation Delay Test Condition (pF) | 150 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 85 |
| Standard Package Name | DIP | |
| Supplier Package | PDIP | |
| Mounting | Through Hole | |
| Package Height | 3.5 | |
| Package Length | 25.1(Max) | |
| Package Width | 6.4 | |
| PCB changed | 20 | |
| Lead Shape | Through Hole | |
| RoHS | Compliant | |
| Packaging | Tube | |
| Part Status | Obsolete | |
| Max Operating Temperature | 85 °C | |
| Min Operating Temperature | -40 °C | |
| Pin Count | 20 | |
| Output Type | 3-State | |
| Polarity | Inverting | |
| Max Supply Voltage | 6 V | |
| Min Supply Voltage | 2 V | |
| Propagation Delay | 190 ns | |
| Logic Function | D-Type Bus Interface | |
| Width | 6.4 mm | |
| Height | 3.5 mm | |
| Length | 25.1 mm | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
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TC74HC564AP(F) Documents
Download datasheets and manufacturer documentation for TC74HC564AP(F)
- datasheetstoshiba-tc74hc564aff-datasheets-2493.pdf
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