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TC55YEM416BXGN70 Tech Specifications

Category Memory
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 48Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30
Access Time-Max 85 ns
Number of Words 1048576 wordsWord
Number of Words Code 1000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.2 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.65 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.012 mA
Organization 1MX16
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 16777216 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 1 V
Length 11 mm
Width 8 mm
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