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TC59LM906AMG-37 Tech Specifications

Category Memory
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 64Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code BGA
Package Description TBGA, BGA60,6X15,40
Access Time-Max 0.5 ns
Clock Frequency-Max (fCLK) 266 MHz
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA60,6X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 2.5 V
JESD-609 Code e1
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.28
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.375 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.45 mA
Organization 64MX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.09 A
Memory Density 536870912 bit
I/O Type COMMON
Memory IC Type DDR1 DRAM
Sequential Burst Length 2,4
Interleaved Burst Length 2,4
Access Mode MULTI BANK PAGE BURST
Self Refresh YES
Length 16.5 mm
Width 12.7 mm
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