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THGBM3G4D1FBAIG Tech Specifications

Category Specialized
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 153Terminals
Number of Words 2147483648 wordsWord
Number of Words Code 2000000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3.3 V
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code BGA
Package Description TFBGA,
ECCN Code EAR99
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Pin Count 153
JESD-30 Code R-PBGA-B153
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode SYNCHRONOUS
Organization 2GX8
Seated Height-Max 1.2 mm
Memory Width 8
Memory Density 17179869184 bit
Memory IC Type MEMORY CIRCUIT
Length 13 mm
Width 11.5 mm
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THGBM3G4D1FBAIG Documents

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