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THGBMAG7B2JBAWM Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 169Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Package Description BGA,
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B169
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
Host Data Transfer Rate-Max 275 MBps
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THGBMAG7B2JBAWM Documents

Download datasheets and manufacturer documentation for   THGBMAG7B2JBAWM

  • Datasheets
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