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Toshiba America Electronic Components THGBMHG9C8LBAB8 Memory Modules
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THGBMHG9C8LBAB8 Tech Specifications
| Category | Memory - Modules | |
| Manufacturer | Toshiba | |
| Surface Mount | YES | |
| Number of Terminals | 153Terminals | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | FBGA-153 | |
| Date Of Intro | 2017-06-23 | |
| Number of Words | 68719476736 wordsWord | |
| Number of Words Code | 64000000000Words Codes | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| ECCN Code | EAR99 | |
| Additional Feature | ALSO ORGANISED AS 512GX1 |
| HTS Code | 8542.32.00.51 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PBGA-B153 | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | 64GX8 | |
| Memory Width | 8 | |
| Memory Density | 549755813888 bit | |
| Screening Level | AEC-Q100 | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 2.7 V | |
| Alternate Memory Width | 4 |
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