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THGBMJG6C1LBAB7 Tech Specifications

Category Memory - Modules
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 153Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer TOSHIBA CORP
Package Description VFBGA-153
Date Of Intro 2019-04-18
Clock Frequency-Max (fCLK) 52 MHz
Number of Words 8589934592 wordsWord
Number of Words Code 8000000000Words Codes
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3.3 V
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B153
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode SYNCHRONOUS
Organization 8GX8
Seated Height-Max 1 mm
Memory Width 8
Memory Density 68719476736 bit
Screening Level AEC-Q100
Parallel/Serial PARALLEL
Memory IC Type FLASH MODULE
Programming Voltage 3.3 V
Length 13 mm
Width 11.5 mm
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THGBMJG6C1LBAB7 Documents

Download datasheets and manufacturer documentation for   THGBMJG6C1LBAB7

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