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THGBMNG5D1LBAIT Tech Specifications

Category Memory - Modules
Manufacturer Toshiba
Surface Mount YES
Material polyethylene
Number of Terminals 153Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer TOSHIBA CORP
Package Description WFBGA-153
Date Of Intro 2019-01-21
Number of Words 4294967296 wordsWord
Number of Words Code 4000000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Gross weight 1.25
Transport packaging size / quantity 48*31.5*22/15000
Additionally with a red stripe
Useful height (B) 100 mm
ECCN Code EAR99
Type PE bag with zip lock
Color transparent
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B153
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 4GX8
Memory Width 8
Memory Density 34359738368 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 2.7 V
Features zip-lock
Width 100 mm
Thickness 45 μm
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THGBMNG5D1LBAIT Documents

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