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TMP1962C10BXBG Tech Specifications

Category Embedded - Microprocessors
Manufacturer Toshiba
Surface Mount YES
Number of Terminals 281Terminals
Part Life Cycle Code End Of Life
Ihs Manufacturer TOSHIBA CORP
Part Package Code BGA
Package Description BGA, BGA281,18X18,25
Clock Frequency-Max 13.5 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA281,18X18,25
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.5 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Additional Feature LOW POWER TAKEN FROM STANDBY MODE
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 281
JESD-30 Code S-PBGA-B281
Qualification Status Not Qualified
Temperature Grade OTHER
Speed 40.5 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Supply Current-Max 46 mA
Bit Size 32
Seated Height-Max 1.4 mm
Address Bus Width 24
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
Length 13 mm
Width 13 mm
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TMP1962C10BXBG Documents

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  • Datasheets
TMP1962C10BXBG brand manufacturers: Toshiba America Electronic Components, Elecinsight stock, TMP1962C10BXBG reference price.Toshiba America Electronic Components. TMP1962C10BXBG parameters, TMP1962C10BXBG Datasheet PDF and pin diagram description download.You can use the TMP1962C10BXBG Embedded - Microprocessors, DSP Datesheet PDF, find TMP1962C10BXBG pin diagram and circuit diagram and usage method of function,TMP1962C10BXBG electronics tutorials.You can download from the Elecinsight.